Development apparatus for manufacturing semiconductor device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO

7025514

APP PUB NO

20040106298A1

SERIAL NO

10676073

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A development apparatus for discharging a developer onto a surface of a semiconductor substrate (15) comprises a nozzle pipe (13) for supplying the developer, and a nozzle (14) having a shape of a spoon with a taper and discharging the developer supplied by the nozzle pipe onto the surface of the substrate. The nozzle sprays the developer onto the surface of the substrate at any spray angle under a low and constant pressure.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
OKI SEMICONDUCTOR CO., LTD.TOKYO179

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ohta, Yasuharu Miyazaki, JP 1 2
Shimada, Keizo Miyazaki, JP 39 401

Cited Art Landscape

Patent Info (Count) # Cites Year
 
ADVANCED MICRO DEVICES, INC. (1)
6376013 Multiple nozzles for dispensing resist 26 1999
* Cited By Examiner

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
UNITED MICROELECTRONICS CORP. (3)
8707974 Wafer cleaning device 0 2009
* 2011/0139,188 WAFER CLEANING DEVCIE AND METHOD THEREOF 1 2009
9539621 Wafer cleaning device and method thereof 0 2013
 
Bauer Products, Inc. (1)
* 2010/0171,326 LOCKABLE HANDLE ASSEMBLY 3 2009
* Cited By Examiner

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