US Patent No: 7,025,514

Number of patents in Portfolio can not be more than 2000

Development apparatus for manufacturing semiconductor device

ALSO PUBLISHED AS: 20040106298

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Importance

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Abstract

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A development apparatus for discharging a developer onto a surface of a semiconductor substrate (15) comprises a nozzle pipe (13) for supplying the developer, and a nozzle (14) having a shape of a spoon with a taper and discharging the developer supplied by the nozzle pipe onto the surface of the substrate. The nozzle sprays the developer onto the surface of the substrate at any spray angle under a low and constant pressure.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
OKI SEMICONDUCTOR CO., LTD.TOKYO1283

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ohta, Yasuharu Miyazaki, JP 2 1
Shimada, Keizo Hitachi, JP 48 339

Cited Art Landscape

Patent Info (Count) # Cites Year
 
ADVANCED MICRO DEVICES, INC. (1)
6,376,013 Multiple nozzles for dispensing resist 26 1999

Patent Citation Ranking

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Patent Info (Count) # Cites Year
 
UNITED MICROELECTRONICS CORP. (1)
8,707,974 Wafer cleaning device 0 2009

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