Gradient polishing pad made from paper-making fibers for use in chemical/mechanical planarization of wafers
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United States of America Patent
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Apr 11, 2006
Grant Date -
Apr 15, 2004
app pub date -
Jun 18, 2003
filing date -
Jun 18, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A composite polishing pad for use in chemical-mechanical planarization (CMP) processes, which polishing pad of the invention is made of a paper-making-process produced fibrous-matrix of paper-making fibers bound with resin material, and consists of a top section with one or more lower sections, where each layer has unique material properties. Polishing performance can be substantially improved by modifying the individual characteristics of each layer. Typically, the top layer or working surface will be of a higher modulus material than the lower layers. Therefore, the sub-layers may consist of lower density regions or a modified surface structure, such as grooving, to effectively modify the bulk modulus.
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