Microelectronic workpiece for electrochemical deposition processing and methods of manufacturing and using such microelectronic workpieces
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United States of America Patent
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Apr 11, 2006
Grant Date -
Feb 26, 2004
app pub date -
Aug 21, 2002
filing date -
Aug 21, 2002
priority date (Note) -
Expired
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Abstract
Methods for forming microelectronic workpieces used in electrochemical deposition processes, methods of depositing a conductive layer on a microelectronic workpiece, and articles for electrochemical deposition in semiconductor fabrication. One aspect of the invention is directed toward methods for forming microelectronic workpieces that are well-suited for electrochemical deposition processes. On embodiment of such a method comprises depositing a first conductive material on a workpiece to form an electrically conductive first layer that conforms to the workpiece. This embodiment further includes forming a seed region defined by a second layer of a second conductive material on the first layer, and forming a contact region defined by an exposed portion of the first layer that is not covered by the second layer. The contact region can extend around at least a portion of the perimeter of the workpiece.
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