Electronics assembly with arrangement for air cooling
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United States of America Patent
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-
Apr 11, 2006
Grant Date -
Feb 24, 2005
app pub date -
Aug 19, 2003
filing date -
Aug 19, 2003
priority date (Note) -
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status (Latency Note)
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Abstract
An electronics assembly, for example a computer that may be employed as a network server, has an enclosure, and a plurality of heat-generating components such as microprocessors located inside the enclosure. One or more fans may be provided for maintaining a through flow of air for cooling the components of the assembly. The heat-generating components are located within the enclosure in line with the direction of the flow of air, and the heat-sinks have a configuration such that the air flows over them in parallel. The heat-sinks may each have a flat base for mounting on the component, and a cantilevered portion having one end located on the base, and another end that extends beyond the base and over the base of the other heat-sink, but not in contact with it.
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