Bonding layer for bonding resin on copper surface
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United States of America Patent
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Apr 18, 2006
Grant Date -
Nov 4, 2004
app pub date -
Apr 16, 2004
filing date -
Apr 30, 2003
priority date (Note) -
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status (Latency Note)
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Abstract
A bonding layer for bonding resin is provided that is formed on a copper surface, and contains an alloy of: (a) copper; (b) tin; and (c) at least one type of metal (third metal) selected from the group consisting of: silver, zinc, aluminum, titanium, bismuth, chromium, iron, cobalt, nickel, palladium, gold, and platinum. The copper is contained in an amount of 1 to 50 atom %, the tin is contained in an amount of 20 to 98 atom %, and the third metal is contained in an amount of 1 to 50 atom %. The bonding layer has a thickness of not less than 0.001 μm and not more than 1 μm. Thus, adhesion between copper and resin can be enhanced.
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