Inspection for alignment between IC die and package substrate
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United States of America Patent
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Apr 18, 2006
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app pub date -
Apr 7, 2004
filing date -
Apr 7, 2004
priority date (Note) -
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Abstract
In a method and system for inspecting alignment between an IC (integrated circuit) die and a package substrate, a plurality of fiducials are located on the package substrate for determining a plurality of references. A center point of the package substrate is determined from the plurality of references. In addition, whether a center point of the IC die is aligned to the center point of the package substrate within an acceptable range is determined.
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