Electronic control unit
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 18, 2006
Issued Date -
N/A
app pub date -
Jul 1, 2004
filing date -
Mar 28, 2002
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An electronic control device having a high heat dissipating ability includes a printed board secured to an enclosure and interposed between a case and a cover with screws passing through the printed board. Thermally conductive thin film layers made of copper foil are formed in parallel on a mount face and an opposite mount face of the printed board and inside the printed board so as to be thermally separated from each other. A protrusion is provided on the cover and protrudes beyond a bottom part of the cover toward the position where an electronic component is mounted. A flexible, semi-solid thermally conductive material is placed between an end face of the protrusion and the opposite mount face of the printed board corresponding to the position where the electronic component is mounted to be in contact with the end face and the opposite mount face.
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