Method for producing a wafer interposer for use in a wafer interposer assembly
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United States of America Patent
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May 2, 2006
Issued Date -
N/A
app pub date -
Feb 24, 2003
filing date -
Dec 15, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method for producing a wafer interposer (210) for use in a wafer interposer assembly is disclosed. The wafer interposer (210) is produced by attaching solder bumps (140) to a lower surface of a support (120). First electrical terminals (130) are attached to an upper surface of the support (120) and substantially correspond to the solder bumps (140). First electrical pathways are provided that passes through the support (120) and connect the solder bumps (140) to the first electrical terminals (130). Second electrical terminals (310) are attached to the upper surface of the support (120). Second electrical pathways (320) connect the first electrical terminals (130) to the second electrical terminals (310).
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