Methods for fabricating interposers including upwardly protruding dams
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United States of America Patent
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May 9, 2006
Issued Date -
N/A
app pub date -
Feb 25, 2004
filing date -
Apr 28, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method for fabricating an interposer includes providing an interposer substrate with at least one slot or aperture therethrough and forming at least one upwardly protruding dam on the interposer substrate, adjacent to the slot or aperture. The upwardly protruding dam or dams may at least partially surround the slot or aperture. Accordingly, the upwardly protruding dam or dams may laterally confine encapsulant material over the slot or aperture and over any intermediate conductive elements extending through the slot or aperture. Programmed material consolidation processes, such as stereolithography, may be used to form the at least one upwardly protruding dam.
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