Stereolithographic method for fabricating stabilizers for semiconductor devices
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United States of America Patent
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May 9, 2006
Grant Date -
N/A
app pub date -
Jun 8, 2000
filing date -
Jun 8, 2000
priority date (Note) -
Expired
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Abstract
One or more stabilizers are disposed on the surface of a semiconductor device component prior to bonding the same to a higher-level substrate. Upon assembly of the semiconductor device component face-down upon a higher-level substrate and joining conductive structures between the contact pads of the semiconductor device component and corresponding contact pads of the higher-level substrate, the stabilizers at least partially stabilize the semiconductor device component on the higher-level substrate to maintain a substantially parallel relation therebetween. The stabilizers can also be positioned and configured to define a minimum, substantially uniform distance between the semiconductor device component and the higher-level substrate. The stabilizers may be preformed structures or fabricated on the surface of the semiconductor device component, such as by way of a stereolithographic method.
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