Metal bump with an insulating sidewall and method of fabricating thereof
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United States of America Patent
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-
May 9, 2006
Grant Date -
Mar 11, 2004
app pub date -
Sep 8, 2003
filing date -
Aug 29, 2000
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Metal bumps for connecting a nonconducting substrate and a chip without lateral shorting are provided. In a first preferred embodiment, an insulating layer covers the entire sidewalls of all the metal bumps. In a second preferred embodiment, predetermined portions of a first metal bump and a second metal bump are covered with an insulating layer. For example, a first predetermined portion of the sidewall of the first metal bump may be zcovered with an insulating layer, while a second predetermined portion of the sidewall of the second sidewall is also covered with an insulating layer.
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