Detergent injection systems and methods for carbon dioxide microelectronic substrate processing systems
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United States of America Patent
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May 16, 2006
Issued Date -
N/A
app pub date -
Sep 27, 2002
filing date -
May 14, 1999
priority date (Note) -
Expired
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Abstract
Microelectronic substrate processing systems include a microelectronic substrate processing chamber that is configured to contain therein at least one microelectronic substrate. A carbon dioxide supply system is configured to supply densified carbon dioxide to the microelectronic substrate processing chamber. A detergent supply system is configured to supply detergent to the microelectronic substrate processing chamber.
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