High density patching system with longframe jacks
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United States of America Patent
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May 16, 2006
Grant Date -
Jan 26, 2006
app pub date -
Jul 20, 2004
filing date -
Jul 20, 2004
priority date (Note) -
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status (Latency Note)
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Abstract
A patching system is disclosed herein. The patching system includes a plurality of front-loaded patching modules positionable within a chassis. Each of the patching modules includes first and second longframe jack assemblies and a switch for changing the circuit configurations of the patching module. The patching modules and the chassis provide increased patching density.
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