Placement of absorbing material in a semiconductor device
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United States of America Patent
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May 16, 2006
Grant Date -
N/A
app pub date -
Dec 9, 2004
filing date -
Dec 9, 2004
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A semiconductor device includes a hermetically sealed housing having a top member and a bottom member. The bottom member includes a recess. A semiconductor die is enclosed within the housing. Absorbing material is positioned in the recess under the semiconductor die. A porous film is positioned between the semiconductor die and the absorbing material.
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