Semiconductor device and method of fabricating the same
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United States of America Patent
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May 16, 2006
Issued Date -
N/A
app pub date -
Feb 28, 2003
filing date -
Mar 1, 2002
priority date (Note) -
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Abstract
A semiconductor device is disclosed which has a first substrate with wiring formed thereon, a second substrate mounted above the first substrate with a conductive plug buried in the second substrate to penetrate between upper and lower surfaces thereof, a plurality of semiconductor chips mounted above the second substrate and having a terminal electrode as electrically connected to the first substrate through the conductive plug of the second substrate, and a resin buried in an empty space or gap between adjacent ones of the plurality of semiconductor chips.
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