Chip on glass package
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
May 23, 2006
Grant Date -
Mar 24, 2005
app pub date -
Sep 23, 2004
filing date -
Sep 23, 2003
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A chip on glass package. A glass substrate has a top surface and a corresponding bottom surface. A plurality of chips are flip-chip mounted on the top surface of the glass substrate. The bottom surface of the glass substrate is secured to and electrically connected with a carrier. An encapsulation material is formed around the glass substrate to seal the chips. The encapsulation material has a cavity to expose the contact area of the top surface of the glass substrate. Therefore the chip on glass package is to possess a better protection and electrical connection of the glass substrate.
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