Systems and slurries for chemical mechanical polishing

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May 30, 2006
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Jan 19, 2005
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Jan 19, 2005

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Abstract

Systems and methods are disclosed for polishing a semiconductor substrate having a polymer film surface deposited thereon by chemishearing the surface; and performing chemical mechanical polishing (CMP) on the chemisheared surface.

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Patent Owner(s)

Patent Owner	Address
ANJI MICROELECTRONICS TECHNOLOGY (SHANGHAI) CO LTD	201201 T6-9 JINQIAO EXPORT PROCESSING ZONE (SOUTH DISTRICT) NO 5001 EAST CHINA ROAD SHANGHAI PUDONG NEW AREA SHANGHAI CITY SHANGHAI CITY 201201

International Classification(s)

B24B:MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR PO....

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[Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Yang, Andy Chunxiao	Shanghai, CN	5	29
Yu, Chris Chang	Shanghai, CN	26	578

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Systems and slurries for chemical mechanical polishing

Number of patents in Portfolio can not be more than 2000

United States of America Patent

11038514

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PATENT NO	7052373
SERIAL NO	11038514
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11038514

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