Semiconductor multi-package module having inverted bump chip carrier second package
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United States of America Patent
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May 30, 2006
Grant Date -
Jun 24, 2004
app pub date -
Oct 8, 2003
filing date -
Oct 8, 2002
priority date (Note) -
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status (Latency Note)
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Abstract
A semiconductor multi-package module has stacked lower and upper packages, each of which includes a die attached to a substrate, in which the second package is inverted, in which the upper and lower substrates are interconnected by wire bonding, and in which the inverted second package comprises a bump chip carrier package. Also, a method for making a semiconductor multi-package module, by providing a lower molded package including a lower substrate and a die, affixing an upper bump chip carrier package including an upper substrate in inverted orientation onto the upper surface of the lower package, and forming z-interconnects between the upper and lower substrates.
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