Printed wiring board having heat radiating means and method of manufacturing the same
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United States of America Patent
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May 30, 2006
Issued Date -
N/A
app pub date -
Mar 28, 2001
filing date -
Mar 29, 2000
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
In the present invention, a printed wiring board with an electronic component mounted on a circuit board in which the electronic component is provided with a heat radiating plate for conducting heat internally generated, includes a heat radiating device mounted at a position corresponding to the electronic component on a rear surface of the circuit board.
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