Direct photo-patterning of nanoporous organosilicates, and method of use

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United States of America Patent

PATENT NO 7056840
APP PUB NO 20050070124A1
SERIAL NO

10676422

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Abstract

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A low dielectric constant, patterned, nanoporous material and a method of forming the material. The material is formed by depositing a layer onto a substrate, said layer comprising a reactive organosilicate material, a porogen, an initiator, and a solvent; exposing portions of the layer to energy (e.g., thermal energy or electromagnetic radiation) to change the solubility of portions of the organosilicate material with respect to the solvent; selectively removing more soluble portions of the layer to generate a relief pattern; and decomposing the porogen to thereby generate a nanoporous organosilicate layer.

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Patent Owner(s)

Patent OwnerAddress
INTERNATIONAL BUSINESS MACHINES CORPORATIONNEW ORCHARD ROAD ARMONK NY 10504

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Connor, Eric Los Gatos, CA 49 1046
Kim, Ho-Cheol San Jose, CA 64 1337
Lee, Victor Yee-Way San Jose, CA 41 457
Miller, Robert Dennis San Jose, CA 97 2092
Volksen, Willi San Jose, CA 83 1015
Wallraff, Gregory Michael Morgan Hill, CA 35 943

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