Methods for securing vertically mountable semiconductor devices in back-to back relation
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 6, 2006
Issued Date -
N/A
app pub date -
Sep 1, 2004
filing date -
Mar 31, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method for assembling vertically mountable semiconductor devices includes positioning the semiconductor devices so that backsides thereof face one another and that edges of the vertically mountable semiconductor devices along which contacts are disposed are in alignment with each other. The backsides of the vertically mountable semiconductor devices are secured to one another with an adhesive. Individual devices, such as dice, may be positioned and secured to one another in this manner, or larger, multiple-device-carrying substrates, such as device-bearing wafers, may be positioned back-to-back and secured to one another. If the assembled semiconductor devices are carried by larger substrates, individual modules may be subsequently separated from each other.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully