Importance

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Abstract

An integrated circuit having at least one micromechanical element thereon is described comprising a support substrate, a sensor element electrically connected to a logic circuit, and the logic circuit electrically connected to a semiconductor visual display element. The integrated circuit may be manufactured by a process which comprises providing a support substrate, forming at least two elements selected from a first group consisting of a micromechanical sensor element, a logic circuit and a semiconductor visual display element on said support, and manufacturing at third element on said support substrate, said third element selected from a second group consisting of a micromechanical sensor element, logic circuit and a semiconductor display element, which was not selected from the first group. In one embodiment of the process of manufacture, all three of at least three elements are constructed on the support itself, preferably by a microlithographic process.

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First Claim