Resin composition, heat-resistant resin paste and semiconductor device using them and method for manufacture thereof
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United States of America Patent
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Jun 13, 2006
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N/A
app pub date -
Mar 6, 2001
filing date -
Mar 6, 2000
priority date (Note) -
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Abstract
There are disclosed a resin composition comprising (A) a heat-resistant resin soluble in a solvent at room temperature, (B) a heat-resistant resin which is insoluble in a solvent at room temperature but becomes soluble by heating, and (C) a solvent; a heat-resistant resin paste further containing (D) particles or liquid state material D showing rubber elasticity; and a semiconductor device using the same and a method for producing the same.
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