Multi-surface IC packaging structures and methods for their manufacture
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United States of America Patent
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Jun 13, 2006
Grant Date -
May 5, 2005
app pub date -
Sep 23, 2004
filing date -
Sep 24, 2003
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An IC package having multiple surfaces for interconnection with interconnection elements making connections from the IC chip to the I/O terminations of the package assembly which reside on more than one of its surfaces and which make interconnections to other devices or assemblies that are spatially separated.
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