Components, methods and assemblies for multi-chip packages
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United States of America Patent
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Jun 13, 2006
Grant Date -
Dec 30, 2004
app pub date -
Oct 10, 2003
filing date -
Oct 11, 2002
priority date (Note) -
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status (Latency Note)
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Abstract
An ultra thin system-in-a-package (SIP) with independent test and repair capability comprises an interposer having arranged on a top surface and a bottom surface thereof a number of packaged semiconductor chips mounted via solder bumps in accordance with a Land Grid Array (LGA) format and wherein no underfill is used on the SIP.
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