Memory package
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Jun 20, 2006
Issued Date -
N/A
app pub date -
Aug 18, 2004
filing date -
Mar 28, 2002
priority date (Note) -
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status (Latency Note)
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Abstract
A memory chip package with a controller die on a first side of a printed circuit board and a memory die on a second side of the same printed circuit board. The memory chip package is integrated into a microprocessor controlled device or alternatively is integrated into a portable memory card.
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