US Patent No: 7,064,809

Number of patents in Portfolio can not be more than 2000

Apparatus and method for processing wafers

ALSO PUBLISHED AS: 20050168715

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Abstract

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An apparatus for processing semiconductor wafers includes: a wafer support with a first positioning system that can rotate the wafer support coaxially with a wafer; at least one processing apparatus, which can be moved with a second positioning system such that a processing tool proceeding from the processing apparatus can be guided radially over the wafer; and at least one position determining apparatus for determining a wafer position on the basis of features of the wafer. Alignment marks of the wafer are found and points to be processed, such as laser fuses, are moved by rotation of the wafer and movement of at least one processing apparatus in the radial direction above the wafer.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
QIMONDA AGMUNICH4579

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kemper, Franz Pocking, DE 4 12
Mockel, Jens Munchen, DE 10 11

Cited Art Landscape

Patent Info (Count) # Cites Year
 
CHAIPARA PTE., L.L.C. (1)
6,442,312 Optical filter fabrication method and apparatus, optical filter, fiber holder with spiral groove, and phase mask 7 2000
 
CHARTERED SEMICONDUCTOR MANUFACTURING LTD. (1)
6,009,888 Photoresist and polymer removal by UV laser aqueous oxidant 23 1998
 
CHENG, DAVID (1)
5,479,108 Method and apparatus for handling wafers 157 1992
 
FREESCALE SEMICONDUCTOR, INC. (1)
5,982,166 Method for measuring a characteristic of a semiconductor wafer using cylindrical control 107 1997
 
NIKON CORPORATION (1)
5,623,473 Method and apparatus for manufacturing a diffraction grating zone plate 10 1995
 
OKI ELECTRIC INDUSTRY CO., LTD. (1)
6,307,617 Initial alignment system for use in manufacturing an optical filter 9 1999
 
SIEMENS NIXDORF INFORMATIONSSYSTEME AG (1)
4,792,658 Device for soldering electronic structural elements of a circuit plate bar 10 1986
 
SONY CORPORATION (1)
6,592,435 Method of and apparatus for manufacturing recording medium 5 2001
 
SONY PRECISION TECHNOLOGY INC. (1)
6,541,747 Focal mechanism and method for controlling focal point position, and apparatus and method for inspecting semiconductor wafer 16 2000
 
TOKYO ELECTRON LIMITED (1)
6,496,245 Developing method and developing apparatus 14 2001
 
U.S. PHILIPS CORPORATION (1)
5,029,243 Device for working a workpiece using laser light 21 1989
 
Other [Check patent profile for assignment information] (1)
5,558,110 Apparatus for removing particulate matter 15 1994

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
ELECTRO SCIENTIFIC INDUSTRIES, INC. (3)
7,315,038 Methods and systems for positioning a laser beam spot relative to a semiconductor integrated circuit using a processing target as an alignment target 3 2005
7,297,972 Methods and systems for positioning a laser beam spot relative to a semiconductor integrated circuit using a processing target as a metrology target 4 2006
7,964,819 Methods and systems for positioning a laser beam spot relative to a semiconductor integrated circuit using a processing target as a metrology target 2 2007

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11.5 Year Payment $7400.00 $3700.00 $1850.00 Dec 20, 2017
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