Multi-tier keypad assembly
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United States of America Patent
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Jun 27, 2006
Issued Date -
N/A
app pub date -
Dec 17, 2004
filing date -
Dec 17, 2004
priority date (Note) -
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status (Latency Note)
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Abstract
A multi-tier keypad includes at least a first circuit board having a first circuit and a second circuit board having a second circuit, wherein the second circuit board is disposed adjacent to the first circuit board, one or more first key assemblies for providing input to the first circuit when a first key assembly is pressed and one or more second key assemblies for providing input to the second circuit when a second key assembly is pressed. Apertures are formed through the first circuit board. These apertures allow the second key assemblies to extend through the first circuit board for providing input to the second circuit.
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