Semiconductor package having improved adhesiveness and ground bonding
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United States of America Patent
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Jun 27, 2006
Issued Date -
N/A
app pub date -
Jun 15, 2004
filing date -
Oct 15, 1999
priority date (Note) -
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Abstract
A semiconductor package having improved adhesiveness between the chip paddle and the package body and having improved ground-bonding of the chip paddle. A plurality of through-holes are formed in the chip paddle for increasing the bonding strength of encapsulation material in the package body. A plurality of tabs are formed in the chip paddle may also be used alone or in conjunction with the through-holes to further increase the bonding strength of the encapsulation material in the package body. The tabs provide additional area for the bonding site to ground wires from the semiconductor chip by increasing the length of the chip paddle.
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