Three-dimensional stacked semiconductor package with metal pillar in encapsulant aperture
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 27, 2006
Issued Date -
N/A
app pub date -
Oct 15, 2004
filing date -
Oct 13, 2000
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A three-dimensional stacked semiconductor package includes first and second semiconductor chip assemblies. The first semiconductor chip assembly includes a first chip, a first conductive trace and a first encapsulant, and the first conductive trace includes a first metal pillar. The second semiconductor chip assembly includes a second chip, a second conductive trace and a second encapsulant, and the second encapsulant includes a second aperture. The first metal pillar extends into the second aperture.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully