Test structure embedded in a shipping and handling cover for integrated circuit sockets and method for testing integrated circuit sockets and circuit assemblies utilizing same
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United States of America Patent
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Jun 27, 2006
Grant Date -
Nov 3, 2005
app pub date -
Apr 28, 2004
filing date -
Apr 28, 2004
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A device for enabling testing of electrical paths through a circuit assembly is presented. The device may include a test facilitating shipping and handling cover for a socket of the circuit assembly. The test facilitating shipping and handling cover may have a conductive layer for capacitively coupling to an array of pins in the socket during testing. A method for testing continuity of electrical paths through a circuit assembly is presented. In the method, one or more nodes of the circuit assembly are stimulated, contacts of a socket on the circuit assembly are capacitively coupled with a conductive layer of a shipping and handling cover mated with the socket, and an electrical characteristic is measured by a tester coupled to the shipping and handling cover to determine continuity of electrical paths through the circuit assembly.
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