Importance

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Abstract

A temperature control system for multiple process components in a semiconductor processing facility includes a common cooling unit for controlling the temperature of a cooling fluid and multiple remote temperature control modules in fluid communications with the common cooling unit that separately control the temperature of the multiple process components. The remote temperature control modules are located near the process components and each remote temperature control module includes a circulation loop for the cooling fluid from the common cooling unit and a circulation loop for a heat transfer fluid that received from a process component. A heat exchanger within the remote temperature control module allows heat transfer between the heat transfer fluid and the cooling fluid, thereby cooling the process component. A heat source may also be included within the remote temperature control module to provide heat to the heat transfer fluid and to the process component.

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First Claim