High performance optoelectronic packaging assembly

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7070340
SERIAL NO

10073963

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Abstract

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Optoelectronic packaging assemblies for optically and electrically interfacing a protected electro-optical device or system to both an optical fiber and to external circuitry. Such assemblies are comprised of body components that are comprised of plastic that coated or plated with a conductive material. Electrical contact pins in the form of transmission lines are used to couple external electrical signals with the package. The optoelectronic packaging assemblies are dimensioned with small cavities and with steps, breaks, walls, and/or fins molded into the body components. The optoelectronic packaging assemblies further include an optical input receptacle for receiving an optical ferrule and an optical fiber. The optoelectronic packaging assembly provides for cooling, such as by heat sink fins and/or a thermal-electric-cooler. The transmission line pins and body components are dimensioned to mate with a standardized circuit board having transmission line traces.

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Patent Owner(s)

Patent OwnerAddress
SILICON BANDWIDTH INC46539 FREMONT BOULEVARD FREMONT CA 94538

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Crane, Jr Stanford W Santa Clara, CA 66 1288
Horvath, Zsolt Fremont, CA 7 139
Jeon, Myoung-Soo Fremont, CA 16 203
Nickel, Joshua G San Jose, CA 32 1448

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