Molding system with integrated film heaters and sensors
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United States of America Patent
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Jul 4, 2006
Grant Date -
Nov 11, 2004
app pub date -
Jun 14, 2004
filing date -
Jun 12, 1998
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Film heater apparatus and method for heating a melt channel in a molding device includes structure and/or steps whereby a first dielectric layer is disposed on a surface of a substrate. An active heating element is disposed on the first dielectric layer, the active heating element being configured to generate heat to heat the melt channel. The active heating element has contact terminals arranged to support an electrical connection to the active heating element. A second dielectric layer is disposed over the active heating element, but not covering the contact terminals, thereby permitting coupling of the heater element to an electrical supply.
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