Process for producing microelectromechanical components and a housed microelectromechanical component
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United States of America Patent
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Jul 4, 2006
Issued Date -
N/A
app pub date -
Nov 22, 2004
filing date -
Aug 24, 2001
priority date (Note) -
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Abstract
A process produces microelectromechanical components from a substrate that has a first side and a second side which is substantially opposite from the first side, and at least the first side has at least one microelectromechanical element. The process includes the step of providing at least one conductive passage into the substrate, connecting the first side to the second side, and securing at least one support to the first side of the substrate, with the at least one electrically conductive passage uncovered by thinning the substrate material with the mechanical stability being ensured by the support.
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