Lead frame decoupling capacitor, semiconductor device packages including the same and methods
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United States of America Patent
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Jul 4, 2006
Grant Date -
Mar 20, 2003
app pub date -
Oct 11, 2002
filing date -
Jan 20, 1998
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A lead frame includes at least two layers, each of which includes an electrically conductive bus and a group of leads that extend substantially unidirectionally from a single edge of the lead frame. The lead fingers of each layer may extend in substantially the same direction. The electrically conductive buses of the two or more lead frame layers are at least partially superimposed with respect to one another. An insulator element is disposed between at least portions of the superimposed regions of the buses. One of the buses is connectable to a power supply source (V.sub.CC), while the other is connectable to a power supply ground (V.sub.SS). Thus, the mutually superimposed regions of the buses form a decoupling capacitor. Lead fingers of one of the layers may be arranged in groups which flank the remainder of the lead fingers so that they are not interleaved therewith.
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