Assemblies having stacked semiconductor chips and methods of making same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Jul 4, 2006
Grant Date -
May 27, 2004
app pub date -
Sep 5, 2003
filing date -
Sep 11, 2002
priority date (Note) -
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Abstract
A stacked microelectronic assembly comprises a continuous sheet including a core panel and a plurality of side panels, each having a folded portion that connects the side panel to an edge of the core panel. At least two of the panels are at least partially horizontally aligned with one another in a stack. During manufacture of a stacked microelectronic assembly, failed microelectronic elements are identified and associated side panels thereof are simply cut-off. This results in the production of a usable stacked microelectronic assembly albeit of reduced capacity, or reduced functionality.
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