Semiconductor component having a plastic housing and methods for its production
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United States of America Patent
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Jul 4, 2006
Grant Date -
Mar 10, 2005
app pub date -
Jul 23, 2004
filing date -
Jul 24, 2003
priority date (Note) -
In Force
status (Latency Note)
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Abstract
The invention relates to a semiconductor component having a plastic housing which encloses a rewiring structure which has flat conductors embedded in plastic. The flat conductors are formed either by a slotted metal sheet or by elongated contact connecting pads. Arranged on the contact connecting pads are flip-chip contacts of a semiconductor chip within the plastic housing, while external contact pads are connected to the flip-chip contacts via flat conductors or to the semiconductor chip via elongated contact connecting pads.
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