Semiconductor chip assembly with welded metal pillar
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United States of America Patent
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Jul 4, 2006
Grant Date -
N/A
app pub date -
Nov 10, 2004
filing date -
Oct 13, 2000
priority date (Note) -
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Abstract
A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a metal pillar, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The chip and the metal pillar are embedded in the encapsulant, the routing line extends laterally beyond the metal pillar towards the chip, and the metal pillar is welded to the routing line.
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