Aluminum/ceramic bonding substrate and method for producing same
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United States of America Patent
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Jul 11, 2006
Grant Date -
Apr 22, 2004
app pub date -
Sep 29, 2003
filing date -
Sep 30, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An aluminum plate 12 having a purity of 99.5% or more, preferably 99.9% or more, is caused to contact at least one side of a ceramic substrate 10 of aluminum nitride or alumina to be heated at a temperature of 620 to 650.degree. C. in an inert gas to bond the aluminum plate 12 directly to the ceramic substrate 10.
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