Adhesives for semiconductor applications efficient processes for producing such devices and the devices per se produced by the efficient processes
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United States of America Patent
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Jul 11, 2006
Grant Date -
Mar 20, 2003
app pub date -
Sep 17, 2001
filing date -
Sep 17, 2001
priority date (Note) -
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Abstract
Die attach adhesives and methods for their use, along with the devices that are obtained by the use of the methods. Using semiconductor chips as an example, the adhesives and the method for using them provides an interface between a chip (die) and the chip support. The method includes creating a space between the chip and the chip support of a given sized opening.
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