Surface micromachining process for manufacturing electro-acoustic transducers, particularly ultrasonic transducers, obtained transducers and intermediate products
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United States of America Patent
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Jul 11, 2006
Grant Date -
Sep 16, 2004
app pub date -
May 9, 2002
filing date -
May 9, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A surface micromachining process for manufacturing Electro-acoustic transducers, particularly ultrasonic transducers, the transducers comprising a silicon semiconductor substrate (1), on an upper surface of which one or more membranes (18) of resilient materials are supported by a structural layer (11) of insulating material, rigidly connected to the semiconductor substrate (1), the resilient material having a Young's modulus not lower than 50 GPa, the membranes (18) being metallised, the transducers including one or more lower electrodes (23, 25), rigidly connected to the semiconductor substrate. The process is characterised in that the structural layer (11) includes silicon monoxide. The invention further relates to an Electro-acoustic transducer, particularly an ultrasonic transducer, characterised in that the insulating material of the structural layer (11) is silicon monoxide. The invention also relates to an intermediate product for utilisation in the process for realising Electro-acoustic transducers, particularly ultrasonic transducers.
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