Process for improving dielectric properties in low-k organosilicate dielectric material
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United States of America Patent
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Jul 11, 2006
Grant Date -
Jan 13, 2005
app pub date -
Jul 9, 2003
filing date -
Jul 9, 2003
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Abstract
Low-k organosilicate dielectric material can be exposed to a series of reagents, including a halogenation reagent, an alkylation reagent, and a termination reagent, in order to reverse degradation of dielectric properties caused by previous processing steps.
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