Semiconductor chip assembly with interlocked contact terminal
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United States of America Patent
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Jul 11, 2006
Issued Date -
N/A
app pub date -
May 26, 2005
filing date -
Oct 13, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a metal pillar and a contact terminal, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The contact terminal includes a body and a flange that contact the metal pillar and are spaced from the routing line.
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