Systems and methods for actuating end effectors to condition polishing pads used for polishing microfeature workpieces
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United States of America Patent
Stats
-
Jul 18, 2006
Grant Date -
Feb 2, 2006
app pub date -
Aug 2, 2004
filing date -
Aug 2, 2004
priority date (Note) -
In Force
status (Latency Note)
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Abstract
Systems and methods for activating end effectors used to condition microfeature workpiece polishing pads are disclosed. A system in accordance with one embodiment of the invention includes a rotatable end effector having a conditioning surface configured to condition a microfeature workpiece polishing medium, and a driver coupled to the end effector to rotate the end effector. The driver does not include a flexible, continuous belt coupled to the end effector. For example, the driver can include a motor-driven worm meshed with a worm gear. The system can further include a forcing element coupled to the end effector to apply a force to the end effector that is at least approximately normal to a conditioning surface of the end effector. The forcing element can include a first generally rigid member and a second generally rigid member coupled to the end effector and movable relative to the first generally rigid member to apply the force.
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