Methods for producing a structured metal layer
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United States of America Patent
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Jul 18, 2006
Grant Date -
Jan 24, 2002
app pub date -
Dec 11, 2000
filing date -
Dec 10, 1999
priority date (Note) -
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Abstract
The invention provides methods which can be used to structure even precious metal electrodes with conventional CMP steps, in particular with the aid of conventional slurries such as are already used to structure non-precious metals. Owing to the formation of an alloy, the chemically active components of the slurry are capable of attacking the additive to the precious metal in the alloy, as a result of which the surface of the alloy layer is roughened and the mechanical removal of the precious metal is increased.
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