Circuitized substrate
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United States of America Patent
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Jul 18, 2006
Grant Date -
Oct 13, 2005
app pub date -
Mar 31, 2004
filing date -
Mar 31, 2004
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A circuitized substrate comprising a first layer comprised of a dielectric material including a resin material including a predetermined quantity of particles therein and not including continuous fibers, semi-continuous fibers or the like as part thereof, and at least one circuitized layer positioned on the dielectric first layer. An electrical assembly and a method of making the substrate is also provided, as is a circuitized structure including the circuitized substrate in combination with other circuitized substrates having lesser dense thru-hole patterns. An information handling system incorporating the circuitized substrate of the invention as part thereof is also provided.
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