Microelectronic packages with elongated solder interconnections
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United States of America Patent
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Jul 18, 2006
Issued Date -
N/A
app pub date -
May 11, 2001
filing date -
Sep 18, 1997
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A soldered assembly for a microelectronic element includes a microelectronic element, solder columns extending from a surface of the microelectronic element and terminals connected to distal ends of the columns. The assembly can be handled and mounted using conventional surface-mount techniques, but provides thermal fatigue resistance. The solder columns may be inclined relative to the chip surface, and may contain long, columnar inclusions preferentially oriented along the lengthwise axes of the columns.
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