Methods and apparatus for creating a high speed connection between a device under test and automatic test equipment
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United States of America Patent
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Jul 18, 2006
Issued Date -
N/A
app pub date -
Jul 25, 2005
filing date -
Mar 4, 2003
priority date (Note) -
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status (Latency Note)
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Abstract
A clamping assembly for connecting a first plurality of contacts to a second plurality of contacts on a circuit board. The circuit board has a first outer face and a second outer face. The second contacts are arranged on at least one of the first and second outer faces. The clamping assembly includes a first assembly having a first inner face, and a second assembly having a second inner face substantially parallel to the first inner face. The first plurality of contacts are arranged on at least one of the first and second inner faces. Mechanical alignment features facilitate alignment of the first contacts with the second contacts. The first and second assemblies are configured to enable relative motion therebetween to effect clamping of the first and second inner faces to the first and second outer faces of the circuit board.
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