Memory module cooling
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United States of America Patent
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Jul 18, 2006
Grant Date -
Dec 15, 2005
app pub date -
Jun 14, 2004
filing date -
Jun 14, 2004
priority date (Note) -
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status (Latency Note)
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Abstract
A heatsink for a memory module includes a substantially planar contact portion for forming a thermal contact with the memory module and for mounting the heatsink on the memory module. One or more formations for emitting heat are also provided, the formations for emitting heat being in thermal communication with the contact portions.
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